Using Google Analytics as my thermometer, it's time again to look at what's been statistically hot on the blog this last ...

TE Connectivity is moving to nickel-phosphorus coatings to reduce the CO2 footprint of its connector contact plating processes. Branding the plating stack ...

I wasn't aware of this one, though it launched in April: the self-explanatory Arduino AI Assistant (the AAA). There are three ...

Episode 10 of our podcast CHIIPs is out now, featuring DAC conference chair Professor Helen Li. Helen discusses her plans for this year's DAC conference! Read our special supplement celebrating 60 ...

SiTime is aiming for 24 hour timing hold-over in data centres and 5G infrastructure with temporal synchronising software called TimeFabric. "TimeFabric, ...

The UK Space Agency is providing new funding for five projects that will use satellite data to improve the delivery of public ...

The semiconductor manufacturing equipment industry is expected to have a CAGR of 7% 2024-28 to reach 11.1 million wpm in 2028 ...

Pickering has introduced a reed relay that can stand-off 20kV. "The relay features 12.5kV switching at a maximum of 50W," ...

Diamond Technologies has introduced a series of 28 x 38mm embedded computing modules based around NXP's i.MX 8M processors, ...

Packaging had some well attended Special Sessions at the 75th ECTC of which these three were particularly popular: 1.Advanced ...

DAC 2025: There was a lot of talk about AI at this year’s DAC but one of the most significant was that Siemens Digital Industries Software has added generative and agentic AI capabilities across its ...

UK government semiconductor skills funding, the MEMS market bouncing back, Continental setting up a fabless chip unit, Jensen ...