News

TE Connectivity is moving to nickel-phosphorus coatings to reduce the CO2 footprint of its connector contact plating processes. Branding the plating stack ...
Using Google Analytics as my thermometer, it's time again to look at what's been statistically hot on the blog this last ...
Wolfspeed, the SiC specialist, has filed for Chapter 11 bankruptcy protection. The company has entered arrangement with ...
Episode 10 of our podcast CHIIPs is out now, featuring DAC conference chair Professor Helen Li. Helen discusses her plans for this year's DAC conference! Read our special supplement celebrating 60 ...
SiTime is aiming for 24 hour timing hold-over in data centres and 5G infrastructure with temporal synchronising software called TimeFabric. "TimeFabric, ...
Keysight has combined it Electromagnetic Simulator with Synopsys’ AI-powered RF design migration flow for an integrated ...
The UK Space Agency is providing new funding for five projects that will use satellite data to improve the delivery of public ...
The semiconductor manufacturing equipment industry is expected to have a CAGR of 7% 2024-28 to reach 11.1 million wpm in 2028 ...
Pickering has introduced a reed relay that can stand-off 20kV. "The relay features 12.5kV switching at a maximum of 50W," ...
A tour d’horizon of the challenges facing the IC industry was delivered by Ravi Subramanian, CEO of Berkley Design Automation, to the 2011 Globalpress ...
Chell Instruments has introduced a 32 input thermocouple scanner for temperature measurement in industry and aerospace.
Intel is to close its automotive chip unit and lay off ‘most’ of its employees. The unit operates out of Munich and designs ...