Design And Reuse

IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs

IntelPro Inc. (英特博股份有限公司) is a Taiwan-based semiconductor and AIoT solutions provider headquartered in Zhubei City, Hsinchu County. The company delivers turnkey IC and chipset ...
Design And Reuse

SkyeChip Berhad and Persimmons, Inc. Announce Strategic IP Licensing Partnership

Penang, Malaysia / San Jose, California — SkyeChip Berhad, a leading developer of high-performance semiconductor intellectual property, today announced that it has entered into a strategic IP ...
Design And Reuse

CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression

Semiconductor IP provider CAST today announced the first commercially available JPEG XL encoder IP core, bringing the modern JPEG XL still-image format to consumer and professional camera SoCs.
Design-Reuse

United Micro Technology and Ceva Collaborate for 5G RedCap SoC to Accelerate Connected Vehicle Adoption

United Micro integrates Ceva-PentaG Lite 5G platform IP in RedCap SoC, delivering cost–efficient, secure, and scalable connectivity for next–generation vehicles ROCKVILLE, Md. — As automakers expand ...
Design And Reuse

The Power of Shifting Left: Cadence Accelerating Innovation with Arm

Shifting left means bringing testing, verification, and validation activities forward in the design cycle. Instead of waiting ...
Design And Reuse

Siemens and NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing

Siemens and NIVIDIA showcase advanced digital twin capability; New AI-era Tech Stack for factories of the future; Integrates Siemens Xcelerator and NVIDIA Omnive ...
Design And Reuse

Key ASIC Signals Strong Growth Momentum Amid AI Boom

Key ASIC Berhad has reaffirmed its strong position in the global Artificial Intelligence (AI) and semiconductor markets following its Annual General Meeting (AGM), highlighting a robust turnaround in ...
Design And Reuse

Innatera signs Joya as ODM customer, bringing neuromorphic edge AI into everyday connected products

Partnership will deliver ultra-low-power intelligence for next-gen consumer, IoT, and smart home devices ...
Design And Reuse

Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production

Boston, MA and Hsinchu, TAIWAN - Metalenz, the leader in metasurface innovation and commercialization, and United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today ...
Design And Reuse

Light into data: How silicon photonics is powering the AI data center revolution

Silicon photonics converts electrical signals into optical signals and back again, allowing data to be transmitted as pulses of light. A laser generates a near-infrared light which is then modulated ...
Design And Reuse

GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers

GF will qualify the licensed GaN technology at its manufacturing facility in Burlington, Vermont, leveraging the site’s expertise in high-voltage GaN-on-Silicon technology to accelerate volume ...
Design And Reuse

Keysight Named a Leader in 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools

SANTA ROSA, Calif. -- Keysight Technologies, Inc. (NYSE: KEYS) announced that it has been recognized as a Leader in the 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools. The ...