SK Hynix is reportedly set to begin ordering equipment for its 12-layer sixth-generation high-bandwidth memory (HBM4) as early as November 2025, with installation to begin in early 2026.

Taiwan's electric vehicle market () is poised for a wave of new launches in the second half of 2025, with the upcoming Luxgen ...

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Applied Materials reported US$6.8 billion in revenue for the quarter ended October 26 in FY25, a 3% year-over-year decline ...

Carbon fiber composite manufacturer Bonny Worldwide has successfully expanded from the sports equipment sector into the ...

SMIC warns that an emerging memory shortage could disrupt production of cars, smartphones, and consumer electronics as early ...

G-Shank, a supplier of stamping parts, achieved double-digit revenue growth in the first three quarters of 2025, driven by ...

Maxone Semiconductor (Suzhou) has cleared the Shanghai STAR Market IPO review, a notable milestone in China's effort to end ...

India's smartphone market hit a five-year peak in the festive third quarter of 2025, growing 4.3% year-over-year to 48 ...

SMIC posted stronger-than-expected third-quarter results as China's surging AI investment and state-backed chip earnings. Beijing's push for semiconductor self-sufficiency, set against sharpening ...

Taiwan's leading backlight module suppliers, Coretronic and Radiant Opto-Electronics, are diversifying into new sectors as ...

As AI ASIC makers accelerate the release of next-gen chips to catch up with AI GPU leaders, industry observers expect a major ...